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WG7837-V0
Price:NT$ 310
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WG7837‐V0
WLAN/BT Module
TI WiLink8 IEEE 802.11a/b/g/n MIMO
Bluetooth / Bluetooth LE Solution

Pin to pin with WL1837MOD

The WG7837‐V0 series SiP (System in Package) module, is the most demanded design for
all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth,
Bluetooth LE solutions to provide the best WiFi and BT coexistence interoperability and power
saving technologies from TI.

WG7837‐V0
WLAN/BT Module

Pin to pin with WL1837MOD

 WLAN Baseband Processor and RF transceiver supporting IEEE 802.11a/b/g/n.
 20 and 40MHz SISO and 20MHz 2x2 MIMO at 2.4 GHz for High Throughput:
80 Mbps (TCP), 100 Mbps (UDP)
 2.4‐GHz MRC Support for Extended Range and 5GHz Diversity Capable
 Fully Calibrated: Production Calibration Not Required
 4‐Bit SDIO Host Interface Support
 Wi‐Fi Direct Concurrent Operation. (Multichannel, Multirole)
 LGA‐100 pin package
 Small Form Factor: 13.3 x 13.4 x 2.0 mm.
 FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas
 Operating temperature: ‐40°C to 85°C

 Bluetooth 4.1 Compliance and CSA2 Support
 Host Controller Interface (HCI) Transport for Bluetooth over UART.
 Dedicated Audio Processor Support of SBC encoding + A2DP
 Dual‐Mode Bluetooth and Bluetooth LE

Date
Solution file name
2019-06-12
WG7837-V0-DTS-R02_160127
2.25 MB
2019-06-12
WG78xx module Porting Guide for i

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